Singapore-MIT Alliance (SMA): Recent submissions
Now showing items 94-96 of 554
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Effects of Applied Loads, Effective Contact Area and Surface Roughness on the Dicing Yield of 3D Cu Bonded Interconnects
(2006-01)Bonded copper interconnects were created using thermo-compression bonding and the dicing yield was used as an indication of the bond quality. SEM images indicated that the Cu was plastically deformed. Our experimental and ... -
Characterization of LiNi₀.₅Mn₁.₅O₄ Thin Film Cathode Prepared by Pulsed Laser Deposition
(2006-01)LiNi₀.₅Mn₁.₅O₄ thin films have been grown by pulsed laser deposition (PLD) on stainless steel (SS) substrates. The crystallinity and structure of thin films were investigated by X-ray diffraction (XRD). Microstructure and ... -
Amorphous Al-transition Metal Alloys as Anode Material for Lithium Ion Battery
(2006-01)Al based alloy powders (Al₈₅Ni₅Y₆Co₂Fe₂) are produced by spray atomization method. High energy ball milling is done to modify the surface topology and particle size for better electrochemical performance. X ray diffraction ...
