Warren M. Rohsenow Heat and Mass Transfer Laboratory: Recent submissions
Now showing items 13-15 of 29
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MEMS-based thermal management of high heat flux devices edifice: Embedded droplet impingement for integrated cooling of electronics
(2003-05)Increases in microprocessor power dissipation coupled with reductions in feature sizes due to manufacturing process improvements have resulted in continuously increasing heat fluxes. The ever increasing chip-level heat ... -
Advanced Nuclear Energy Systems: Heat Transfer Issues and Trends
(2004-10-26)Almost 450 nuclear power plants are currently operating throughout the world and supplying about 17% of the world’s electricity. These plants perform safely, reliably, and have no free-release of byproducts to the ...
