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  • Rohsenow Symposium on Future Trends in Heat Transfer
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  • Rohsenow Symposium on Future Trends in Heat Transfer
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Thermal management roadmap: Cooling electronic products from hand-held dvices to supercomputers

Author(s)
Chu, R.C.; Bar-Cohen, Avi; Edwards, David; Herrlin, Magnus; Price, Donald; Schmidt, Roger; Joshi, Jogenda; Chryser, George M.; Garimella, Suresh; Mok, Larry; Sammakia, Bahgat; Yeh, Lian-Tuu; ... Show more Show less
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DownloadCHU_final.pdf (2.273Mb)
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Date issued
2003-05
URI
http://hdl.handle.net/1721.1/7313

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