Now showing items 97-99 of 108

    • A Mechanical Model for Erosion in Copper Chemical-Mechanical Polishing 

      Noh, Kyungyoon; Saka, Nannaji; Chun, Jung-Hoon (2003-01)
      The Chemical-mechanical polishing (CMP) process is now widely employed in the ultralarge scale integration chip fabrication. Due to the continuous advances in semiconductor fabrication technology and decreasing sub-micron ...
    • Imaging at the Nano-scale: State of the Art and Advanced Techniques 

      Aumond, Bernardo D.; El Rifai, Osamah M.; Youcef-Toumi, Kamal (2003-01)
      Surface characteristics such as topography and critical dimensions serve as important indicators of product quality and manufacturing process performance especially at the micrometer and the nanometer scales. This paper ...
    • A Generic Mechanism for Repairing Job Shop Schedules 

      Raheja, Amritpal Singh; Reddy, K. Rama Bhupal; Subramaniam, Velusamy (2003-01)
      Reactive repair of a disrupted schedule is a better alternative to total rescheduling, as the latter is a time consuming process and also results in shop floor nervousness. The schedule repair heuristics reported in the ...