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dc.contributor.authorCañada, Jorge
dc.contributor.authorKim, Hyeonseok
dc.contributor.authorVelásquez-García, Luis Fernando
dc.date.accessioned2025-12-16T17:59:54Z
dc.date.available2025-12-16T17:59:54Z
dc.date.issued2024-02-20
dc.identifier.issn1745-2759
dc.identifier.issn1745-2767
dc.identifier.urihttps://hdl.handle.net/1721.1/164333
dc.description.abstractThis study reports fully 3D-printed, three-dimensional, soft magnetic-cored solenoids that generate three times the largest magnetic fields previously reported from 3D-printed solenoids. The devices are fabricated on a customised, multi-material 3D printer that can extrude both filaments and pellets. Three different kinds of materials are employed to manufacture the reported soft magnetic-cored solenoids: pure PLA (dielectric portions), PLA doped with copper particles (electrically conductive structures), and nylon or PLA doped with metallic particles (soft magnetic cores). Via manufacturing optimisation, the reported devices are 33% smaller and can withstand about twice the current, generating three times more magnetic field. The 3D-printed solenoids generate Gauss-level magnetic fields while drawing tens-of-milliamps currents and can be readily used to implement fully 3D-printed induction sensors. The results of this work extend the state of the art in 3D-printed electronics, enabling the creation of more complex and capable solenoids for in-situ manufactured and in-space manufactured electromagnetic systems.en_US
dc.publisherTaylor & Francisen_US
dc.relation.isversionofhttps://doi.org/10.1080/17452759.2024.2310046en_US
dc.rightsCreative Commons Attribution-Noncommercialen_US
dc.rights.urihttps://creativecommons.org/licenses/by-nc/4.0/en_US
dc.sourceTaylor & Francisen_US
dc.titleThree-dimensional, soft magnetic-cored solenoids via multi-material extrusionen_US
dc.typeArticleen_US
dc.identifier.citationCañada, J., Kim, H., & Velásquez-García, L. F. (2024). Three-dimensional, soft magnetic-cored solenoids via multi-material extrusion. Virtual and Physical Prototyping, 19(1).en_US
dc.contributor.departmentMassachusetts Institute of Technology. Department of Electrical Engineering and Computer Scienceen_US
dc.contributor.departmentMassachusetts Institute of Technology. Department of Mechanical Engineeringen_US
dc.contributor.departmentMassachusetts Institute of Technology. Microsystems Technology Laboratoriesen_US
dc.relation.journalVirtual and Physical Prototypingen_US
dc.eprint.versionFinal published versionen_US
dc.type.urihttp://purl.org/eprint/type/JournalArticleen_US
eprint.statushttp://purl.org/eprint/status/PeerRevieweden_US
dc.identifier.doihttps://doi.org/10.1080/17452759.2024.2310046
dspace.date.submission2025-12-16T17:52:32Z
mit.journal.volume19en_US
mit.journal.issue1en_US
mit.licensePUBLISHER_CC
mit.metadata.statusAuthority Work and Publication Information Neededen_US


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