Fits like a Flex-Glove: Automatic Design of Personalized FPCB-Based Tactile Sensing Gloves
Author(s)
Murphy, Devin; Li, Yichen; Owens, Crystal; Stanton, Layla; Liang, Paul Pu; Luo, Yiyue; Torralba, Antonio; Matusik, Wojciech; ... Show more Show less
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Show full item recordAbstract
Resistive tactile sensing gloves have captured the interest of researchers spanning diverse domains, such as robotics, healthcare, and human-computer interaction. However, existing fabrication methods often require labor-intensive assembly or costly equipment, limiting accessibility. Leveraging flexible printed circuit board (FPCB) technology, we present an automated pipeline for generating resistive tactile sensing glove design files solely from a simple hand photo on legal-size paper, which can be readily supplied to commercial board houses for manufacturing. Our method enables cost-effective, accessible production at under $130 per glove with sensor assembly times under 15 minutes. Sensor performance was characterized under varying pressure loads, and a preliminary user evaluation showcases four unique automatically manufactured designs, evaluated for their reliability and comfort.
Description
CHI EA ’25, Yokohama, Japan
Date issued
2025-04-25Department
Massachusetts Institute of Technology. Computer Science and Artificial Intelligence Laboratory; Massachusetts Institute of Technology. Department of Architecture; Massachusetts Institute of Technology. Media Laboratory; Massachusetts Institute of Technology. Department of Electrical Engineering and Computer SciencePublisher
ACM|Extended Abstracts of the CHI Conference on Human Factors in Computing Systems
Citation
Devin Murphy, Yichen Li, Crystal Elaine Owens, Layla Stanton, Paul Pu Liang, Yiyue Luo, Antonio Torralba, and Wojciech Matusik. 2025. Fits like a Flex-Glove: Automatic Design of Personalized FPCB-Based Tactile Sensing Gloves. In Proceedings of the Extended Abstracts of the CHI Conference on Human Factors in Computing Systems (CHI EA '25). Association for Computing Machinery, New York, NY, USA, Article 280, 1–8.
Version: Final published version
ISBN
979-8-4007-1395-8