MIT Libraries logoDSpace@MIT

MIT
View Item 
  • DSpace@MIT Home
  • MIT Open Access Articles
  • MIT Open Access Articles
  • View Item
  • DSpace@MIT Home
  • MIT Open Access Articles
  • MIT Open Access Articles
  • View Item
JavaScript is disabled for your browser. Some features of this site may not work without it.

FiberCircuits: A Miniaturization Framework To Manufacture Fibers That Embed Integrated Circuits

Author(s)
Honnet, Cedric; Babatain, Wedyan; Luo, Yiyue; Kilic Afsar, Ozgun; Bensahel, Chloe; Nicita, Sarah; Zhu, Yunyi; Danielescu, Andreea; Gershenfeld, Neil; Paradiso, Joseph; ... Show more Show less
Thumbnail
Download3746059.3747802.pdf (12.52Mb)
Publisher with Creative Commons License

Publisher with Creative Commons License

Creative Commons Attribution

Terms of use
Creative Commons Attribution-ShareAlike http://creativecommons.org/licenses/by-sa/4.0/
Metadata
Show full item record
Description
UIST ’25, Busan, Republic of Korea
Date issued
2025-09-27
URI
https://hdl.handle.net/1721.1/164247
Department
Program in Media Arts and Sciences (Massachusetts Institute of Technology); Massachusetts Institute of Technology. Media Laboratory; Massachusetts Institute of Technology. Department of Electrical Engineering and Computer Science
Publisher
ACM|The 38th Annual ACM Symposium on User Interface Software and Technology
Citation
While electronics miniaturization has propelled the evolution of technology from desktops to compact wearables, most devices are still rigid and bulky, often leading to abandonment. To enable interfaces that can truly disappear and seamlessly integrate into daily life, the next evolutionary leap will require further miniaturization to achieve full conformability. With FiberCircuits, we offer design and fabrication guidelines for the manufacturing of high-density circuits that are thin enough for full encapsulation within fibers. Our demonstrations include a 1.4 mm-wide ARM microcontroller with sensors as small as 0.9 mm-wide and arrays of 1 mm-wide addressable LEDs, which were woven into our interactive textiles. We provide example applications from fitness to VR, and propose a scalable fabrication process to enable large-scale deployment. To accelerate future research in HCI, we also made our platform Arduino-compatible, created custom libraries, and open-sourced all the materials. Finally, our technical characterizations demonstrate FiberCircuits’ durability, thanks to its silicone encapsulation for waterproofness and braiding for robustness. From wearables to insertables or even implantables, we believe that by making miniature circuits accessible to researchers and beyond, FiberCircuits will open possibilities for new scalable interfaces that embody imperceptible computing.
Version: Final published version
ISBN
979-8-4007-2037-6

Collections
  • MIT Open Access Articles

Browse

All of DSpaceCommunities & CollectionsBy Issue DateAuthorsTitlesSubjectsThis CollectionBy Issue DateAuthorsTitlesSubjects

My Account

Login

Statistics

OA StatisticsStatistics by CountryStatistics by Department
MIT Libraries
PrivacyPermissionsAccessibilityContact us
MIT
Content created by the MIT Libraries, CC BY-NC unless otherwise noted. Notify us about copyright concerns.