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dc.contributor.authorHonnet, Cedric
dc.contributor.authorBabatain, Wedyan
dc.contributor.authorLuo, Yiyue
dc.contributor.authorKilic Afsar, Ozgun
dc.contributor.authorBensahel, Chloe
dc.contributor.authorNicita, Sarah
dc.contributor.authorZhu, Yunyi
dc.contributor.authorDanielescu, Andreea
dc.contributor.authorGershenfeld, Neil
dc.contributor.authorParadiso, Joseph
dc.date.accessioned2025-12-09T18:30:27Z
dc.date.available2025-12-09T18:30:27Z
dc.date.issued2025-09-27
dc.identifier.isbn979-8-4007-2037-6
dc.identifier.urihttps://hdl.handle.net/1721.1/164247
dc.descriptionUIST ’25, Busan, Republic of Koreaen_US
dc.publisherACM|The 38th Annual ACM Symposium on User Interface Software and Technologyen_US
dc.relation.isversionofhttps://doi.org/10.1145/3746059.3747802en_US
dc.rightsCreative Commons Attribution-ShareAlikeen_US
dc.rights.urihttp://creativecommons.org/licenses/by-sa/4.0/en_US
dc.sourceAssociation for Computing Machineryen_US
dc.titleFiberCircuits: A Miniaturization Framework To Manufacture Fibers That Embed Integrated Circuitsen_US
dc.typeArticleen_US
dc.identifier.citationWhile electronics miniaturization has propelled the evolution of technology from desktops to compact wearables, most devices are still rigid and bulky, often leading to abandonment. To enable interfaces that can truly disappear and seamlessly integrate into daily life, the next evolutionary leap will require further miniaturization to achieve full conformability. With FiberCircuits, we offer design and fabrication guidelines for the manufacturing of high-density circuits that are thin enough for full encapsulation within fibers. Our demonstrations include a 1.4 mm-wide ARM microcontroller with sensors as small as 0.9 mm-wide and arrays of 1 mm-wide addressable LEDs, which were woven into our interactive textiles. We provide example applications from fitness to VR, and propose a scalable fabrication process to enable large-scale deployment. To accelerate future research in HCI, we also made our platform Arduino-compatible, created custom libraries, and open-sourced all the materials. Finally, our technical characterizations demonstrate FiberCircuits’ durability, thanks to its silicone encapsulation for waterproofness and braiding for robustness. From wearables to insertables or even implantables, we believe that by making miniature circuits accessible to researchers and beyond, FiberCircuits will open possibilities for new scalable interfaces that embody imperceptible computing.en_US
dc.contributor.departmentProgram in Media Arts and Sciences (Massachusetts Institute of Technology)en_US
dc.contributor.departmentMassachusetts Institute of Technology. Media Laboratoryen_US
dc.contributor.departmentMassachusetts Institute of Technology. Department of Electrical Engineering and Computer Scienceen_US
dc.identifier.mitlicensePUBLISHER_POLICY
dc.eprint.versionFinal published versionen_US
dc.type.urihttp://purl.org/eprint/type/ConferencePaperen_US
eprint.statushttp://purl.org/eprint/status/NonPeerRevieweden_US
dc.date.updated2025-10-01T07:55:36Z
dc.language.rfc3066en
dc.rights.holderThe author(s)
dspace.date.submission2025-10-01T07:55:37Z
mit.licensePUBLISHER_CC
mit.metadata.statusAuthority Work and Publication Information Neededen_US


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